AMD’s disclosed map starts with a manufacturing arrangement that is broader than a single foundry, but still highly specific. The company uses Taiwan Semiconductor Manufacturing Company (TSM) for wafers tied to its high-performance computing, FPGA, and adaptive SoC products. It also names GlobalFoundries (GFS) in the same arrangement.
AMD’s filing describes the manufacturing split this way:
"Manufacturing Arrangements and Assembly and Test Facilities Third-Party Wafer Foundry Facilities We utilize Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of wafers for our HPC, FPGA and adaptive SoC products and GLOBALFOUNDRIES…"
AMD / SEC filing / Feb. 4, 2026
In plain English, AMD’s disclosed wafer chain runs through TSMC and GlobalFoundries for several important product families. United Microelectronics (UMC) also appears in the map, for programmable-logic devices.
The filing adds a second layer to that foundry picture:
"Additionally, we utilize TSMC, United Microelectronics Corporation (UMC) and Samsung Electronics Co., Ltd. for the production of our ICs in the form of programmable logic devices."
AMD / SEC filing / Feb. 4, 2026
That is three named production sources for that category, with Samsung Electronics not otherwise identified here by ticker. The disclosure is about where AMD makes chips, not a ranking of those manufacturers or a statement about how replaceable any one of them is.
On the sales side, AMD’s semi-custom SoCs sit inside two game consoles. Sony Group (SONY) makes the PlayStation 5, and Microsoft (MSFT) makes the Xbox Series S and X. AMD also names Valve’s Steam Machine PC in the same sentence, though Valve is not a public company in the supplied facts.
"AMD semi-custom SoC products power the Sony PlayStation ® 5, the Microsoft ® Xbox Series S™ and X™ game consoles, as well as the recently revealed Valve Steam Machine PC."
AMD / SEC filing / May 6, 2026
The disclosed customer map is therefore unusually tangible: AMD silicon is in the living-room hardware sold under Sony and Microsoft brands. No revenue concentration figure is supplied here, so this is a product relationship, not a quantified customer ranking.
Sanmina (SANM) is closer to the factory floor than the console brands. AMD says it entered a five-year manufacturing services agreement with the company:
"The Company also entered into a Manufacturing Services Agreement with Sanmina with an initial term of five years."
AMD / SEC filing / Feb. 4, 2026
Sanmina’s own filings also name AMD as both a supplier and a customer, giving the pair a two-way appearance in the supplied disclosures. That is more precise than simply calling Sanmina a vendor: AMD reports a contract, while Sanmina reports both sides of the commercial relationship.
The sharpest piece of corporate geometry arrives in data centers. AMD names Intel (INTC) and Nvidia (NVDA) as primary competitors for its CPU, GPU, DPU, and AI NIC server products. Yet AMD’s filing also cites a partnership between those same two rivals:
"For example, in September 2025, Nvidia announced a partnership and investment in Intel to partner on new data center and client platform products."
AMD / SEC filing / May 6, 2026
That sentence does not say AMD is a party to the Nvidia-Intel deal. It does show the competitive neighborhood AMD itself describes: Intel and Nvidia are both opponents in data-center products, while also appearing together in a partnership disclosure.
Outside data centers, AMD names Lattice Semiconductor (LSCC), Broadcom (AVGO), Marvell Technology (MRVL), and Analog Devices (ADI) among competitors in embedded products. The map gets crowded quickly. AMD’s disclosed ties are not one neat chain from wafer to customer, but a set of overlapping manufacturing, console, contract-production, partnership, and competitive relationships.
These are relationships disclosed in SEC filings, mapped by jodie’s analytics. This is not investment advice.